Features and Benefits

• Thermal Impedance: 0.20°C-in²/W (@25 psi)
• 150°C high temperature reliability
• Natural tack one side for ease of assembly
• Exceptional thermal performance in an insulated pad

Hi-Flow 650P is a thermally conductive phase change material,  reinforced with a polyimide film that is naturally tacky on one side.The  polyimide film provides a high dielectric strength and high cut through  resistance. Hi-Flow 650P offers high temperature reliability ideal for automotive applications.

Hi-Flow 650P is designed for use between a high-power electrical  device requiring electrical isolation from the heat sink and is ideal for  automated dispensing systems.

Henkel recommends the use of spring clips to assure constant  pressure with the component interface and the heat sink. Please refer to the  TO-220 thermal performance data to determine the nominal spring pressure for  your application.

Typical Applications Include

• Spring / clip-mounted devices
• Discrete power semiconductors and modules