Features and Benefits

• Thermal impedance: 0.13°C-in²/W (@25 psi)
• Field-proven polyimide film
                      -excellent dielectric performance
                      -excellent cut-through resistance
  
• Outstanding thermal performance in an insulated pad

      Hi-Flow  300P consists of a thermally conductive 55°C phase change compound  coated on a thermally conductive polyimide film.The polyimide  reinforcement makes the material easy to handle, and the 55°C phase  change temperature minimizes shipping and handling problems.

Hi-Flow 300P achieves superior values in voltage breakdown and  thermal performance when compared to its competition.The product is  supplied on a easy release liner for exceptional handling in high  volume manual assemblies. Hi-Flow 300P is designed for use as a thermal  interface material between electronic power devices requiring  electrical isolation to the heat sink.

Henkel suggests the use of spring clips to assure constant  pressure with the interface and power source. Please refer to thermal  performance data to determine nominal spring pressure for your  application.

Typical Applications Include

• Spring / clip mounted
• Discrete power semiconductors and modules