型号：sil pad 900S
适用：Power supplies，Automotive electronics，Motor controls，Power semiconductors
Features and Benefits
Thermal impedance: 0.61ºC-in2/W (@50 psi)
Low mounting pressures
Smooth and highly compliant surface
General-purpose thermal interface material solution
The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.
Typical Applications Include
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